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Good etching results depend on proper image formation in both organic innerlayer print-andetch and plated-metal etch resists. Etch personnel must be familiar with screened, photosensitive, and plated resists commonly used. The etching of printed boards must begin with suitable cleaning, inspection, and pre-etch steps to ensure acceptable products. Increasingly, metal foil or plating uniformity in structure thickness and freedom from coatings and defects must be maintained to achieve uniform small-feature definition. Plated boards also require careful and complete resist removal. The steps after etching are important because they remove surface contamination and yield sound surfaces. This discussion considers the various types of resists and outlines typical procedures used to etch printed boards using organic and plated resist patterns.

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How to Generate Code 128 Barcode in RDLC Reports
RDLC reports, created by the Visual Studio ReportViewer control based on Report Definition Language Client Side, are local reports and completely run in local ...

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Screened Resists Screen printing is a common method for producing standard copper-printed circuitry on metalclad dielectric and other substrates. The etch-resist material is printed with a positive pattern (circuitry only) for copper etch-only boards or with a negative image (field only) when plated through-holes and metal resist are present. The type of resist material used must meet the requirements for proper image transfer demanded by the printer and for stripping chemistry compatibility. From the metal etcher s point of view, the material needs to provide good adhesion and etch-solution resistance; be free of pinholes, oil, or resin bleed-out; and be readily removable without damage to substrate or circuitry. Typical problems are excessive undercutting, slivers, unetched areas, and innerlayer shorts in multilayer boards. In addition, conductor line lifting may occur when the copper-to-laminate peel strength (or surface contamination) is below specification.

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Step 1: For the Basic of RDLS report follow this link: Create RDLC report. Step 2: Download the bar code font 3 of 9 from this site: Barcode Font.

Hole Plugging Plugged-hole, copper-only boards use alkaline-soluble screen resists in a unique manner. The technique, called hole plugging, makes the SMOBC board possible. This technique can be used with screened images and to augment tent-and-etch processing for small annular ring structures.

UV-Cured Screen Resists Ultraviolet-cured solventless systems are available for print-and-etch and plating applications. These products are resistant to commonly used acidic plating and etching solutions. Stripping must be evaluated carefully.

Fig 117:

Photoresists Dry-film and liquid photoresist materials are capable of yielding the fine-line (0.003 to 0.005 in) circuits needed for production of surface-mount circuit boards. Like screened resists,

9. CPSE Rd, Rs; Compare, Skip if Equal. If Rd Flags affected: none. Clocks: 1/2/3 Example: back_here: CPSE r3, r4 rjmp back_here in r3, PINB

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photosensitive resists can be used to print either negative or positive patterns on the metalclad laminate. Although dry-film and liquid materials differ in both physical and chemical properties, they are considered together for our purpose. In general, both positive- and negative-acting resists offer better protection in acidic rather than alkaline solutions; however, negative-acting types are more tolerant of alkaline solutions. Negative resists, once exposed and developed, are no longer light sensitive and can be processed and stored in normal white light. The positive resists remain light sensitive even after developing and must therefore be protected from white light. Liquid photoresists, although less durable, are capable of finer line definition and resolution. Positive-acting resists are subject to the same problems as are negative-acting resists, although they may be easier to remove cleanly, after exposure, from areas to be etched or plated. Problems related to plating photoresist-coated boards are reviewed in Chap. 29.

Plated Etch Resists At present, the most extensive use of metal-plated resists is found in the production of double-sided and multilayer plated-through-hole circuit boards The most commonly used resists are tin (matte and bright surface) Solder plate (60 percent Sn, 40 percent Pb) continues to be used on some reflow-treated solderable coating situations, but it is not favored for a sacrificial resist that is to be removed for SMOBC processing Nickel, tin/nickel, and gold are occasionally used Silver is used to some extent for light-emitting and liquid crystal applications Details concerning the deposition of these metals are given in Chap 29 The use of these resists is described in the following paragraphs 34251 Tin Plating Thin tin deposits (00002 in) are used to make SMOBC boards where the tin etch resist is stripped after etching Alkaline ammonia etchants are usually favored.

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